Diamond Wheel
Sapphire wafer has high stiffness and penetrability with great difficulty to process. We recommend the WEC high performance grinding wheel, no stuffed and clogged, good quality of the surface, processing time, increased yield, no chipping, no fragments, and to extend the life of the mechanical parts.
Advantages
> Avoid the clog of the wheel. No need to maintain the will during process.
> High remove rate. Reduce the chance of edge chipping and breaking.
> Great surface quality (Ra & Rt).
> Significantly shortened the time for after process.
> Even finished thickness.
> Suitable for multi-piece polishing process.
> Reduced process hour. Increased productivity.
> Smooth machine performance. Reduced part wear and increased service life-span.
> Lowered overall cost.