Single Side Polishing M/C
WEC Single Side Lapping/Polishing machines SSP-50DPAW feature rotary models with sophisticated control systems. This model is capable of executing complex lapping and polishing routines process while producing precise and repeatable results with a special auto-facing unit to control plate performance.
Application
• Sapphire Substrate / Wafer • Semiconductor Wafer • Tungsten Carbide Parts • Ceramic Parts • Valves • Crystal Glass • Oscillator Parts
Specification
Description |
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| Items | SSP-36DPAW | SSP-50DPAW | |
| Polishing plate | Plate material | Oxygen free Cu , Resin-Cu | Oxygen free Cu |
| Or Tin plate (*option) | or Tin plate(*option) | ||
| Plate size | Φ910mm | Φ1240mm | |
| Revolution control | By inverter. | Home position. | |
| Plate cooling | Cooling water jacket | Cooling water jacket | |
| Pressure plate | P. Plate | 4 axles. | 4 axles. (driving force system individually) |
| Block size | 360mmΦ | 485mmΦ | |
| Applied pressure | By cylinder | By cylinder | |
| Work block | - | Auto Centering | |
| Facing unit | Mounting type. | Square type. | |
| Capacity / batch | 4 inch wafer x 24 Pcs | 4 inch wafer x 40 Pcs | |
| 6 inch wafer x 12 Pcs | 6 inch wafer x 24 Pcs | ||
| Utility | Electricity | AC220V, 3Phase, 60Hz | AC220V, 3Phase, 60Hz |
| Pneumatic | 0.5~0.8 Mpa | 0.5~0.8 Mpa | |
| Etc | Machine Size | 1350 *2250 *1920 mm | 1640 *3029 *2575 mm |
| Machine Weight | 3,500Kg. | 5,500Kg. | |
| Controller | Touch Screen (Proface) | Touch Screen (Proface) | |
| Signal lamp with alarm | |||