单面抛光机
单面抛光机(SSP50DPAW)装载旋转式机械机构并且拥有精密的控制系统。此机型具备自动盘面修整功能控制磨盘性能并且可执行精密复杂的研磨与抛光工作并且提供精确与稳定之生产工件。 可对应直径360至最大485mm陶瓷盘与2吋至最大6吋之蓝宝石基板。 此机型具备研磨与抛光多样化材质能力并且达到精密加工水平。
应用
• 蓝宝石基板 • 半导体晶元 • 碳化钨件 • 陶瓷工件 • 阀门 • 水晶玻璃 • 振荡器零件
规格
Description |
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| Items | SSP-36DPAW | SSP-50DPAW | |
| Polishing plate | Plate material | Oxygen free Cu , Resin-Cu | Oxygen free Cu |
| Or Tin plate (*option) | or Tin plate(*option) | ||
| Plate size | Φ910mm | Φ1240mm | |
| Revolution control | By inverter. | Home position. | |
| Plate cooling | Cooling water jacket | Cooling water jacket | |
| Pressure plate | P. Plate | 4 axles. | 4 axles. (driving force system individually) |
| Block size | 360mmΦ | 485mmΦ | |
| Applied pressure | By cylinder | By cylinder | |
| Work block | - | Auto Centering | |
| Facing unit | Mounting type. | Square type. | |
| Capacity / batch | 4 inch wafer x 24 Pcs | 4 inch wafer x 40 Pcs | |
| 6 inch wafer x 12 Pcs | 6 inch wafer x 24 Pcs | ||
| Utility | Electricity | AC220V, 3Phase, 60Hz | AC220V, 3Phase, 60Hz |
| Pneumatic | 0.5~0.8 Mpa | 0.5~0.8 Mpa | |
| Etc | Machine Size | 1350 *2250 *1920 mm | 1640 *3029 *2575 mm |
| Machine Weight | 3,500Kg. | 5,500Kg. | |
| Controller | Touch Screen (Proface) | Touch Screen (Proface) | |
| Signal lamp with alarm | |||
• 良好的线径控制、线材的外形均一 • 杰出的线材张力与强度 • 优异的切割效率 • 相比传统加工方式，缩短 50% 的切割时间 • 加工精准度与完工表面佳 • 可搭配各种不同设备应用