CMP Polish Pad

CMP拋光皮

CMP Polish Pad

WEC-PAD is a fiber based and resin treated (polyurethane) pad with standard thickness rang from 0.05 to 1 inch. WEC series are designed to accommodate diverse polishing applications and surfaces. The material makes excellent interconnecting cellular structures, which makes the pad highly durable and dimensionally stable. These pads are designed to provide rapid stock removal while achieving superb surface finishes. The backside with a pressure-sensitive adhesive coating that provides firm adhesion to metal and ceramic plates while also achieve good roughness of the fine polishing.

Specification

CMP拋光皮
Material Model Groove OD
Fiber WEC-3000 series S(Square) D15 ~ 36(inch)
Flannel WEC-4000 series C(Circle) D15 ~ 36(inch)
PU WEC-5000 series F(Flatness) D15 ~ 36(inch)