Gigabond , two component, consists of resin and hardener. This epoxy adhesive is specially designed for ingot slicing. Quick cure, high adhesion type which can be removed by hot water. This adhesive features no serious disgusting odor, non-flammability and non-evaporative characteristics. customizationiIs available upon request. Perfect for slicing and bonding of work pieces such as silicon and sapphire ingots, boule and blocks.