SINGLE WIRE SAWS M/C
WEC has the great experience of the equipment development over the years and has developed μSWS-1600 Single Wire Saws Machine for the front and end truncation of mono/polycrystalline silicon and sapphire ingots. Combining with MDWEC Diamond-Coated Saw Wire and other relevant technologies, this Single Wire Saws Machine can reduce the waste from the abrasive lapping/polishing and the environmental pollution. Comparing with the conventional productive processes, the Single Wire Saws Machine provides the precise work completion and high productivity.
Application
This product can be applied to truncate large, irregularly-shaped, hard and brittle materials such as silicon crystal, quartz, ceramics, sapphire, glass, gallium arsenide, and so on.
Specification
| Item(Model No.) | uSWS-1700L |
| Workpiece Dimension | Max. 600(H)X 600(W)X 400(D) |
| Wire Running Speed | Max. 800 m/min |
| Wire Guide | Ø163 mm |
| Number of Wire Guides | 6 sets |
| Rocking degree | 0~+/-3 |
| Z Table Stroke | 780mm |
| Z In Feed Rate | 0.01~150mm/min |
| Wire Diameter | Ø0.15~0.35 mm |
| Wire Tension | Max. 60N or Less |
| Volume of The Tank | 100L |
| Installation Dimension | 2620(H) X 1700(W) X 1050(D) |
| Machine Weight | 2500KG |
• Single diamond wire saws design, reciprocal wire travel direction, PLC program control • High wire-speed design; combining with MDWEC Diamond-Coated Wire can shorten the cutting time by 50%, lower cost and enhance the productivity • Rocking options are available for improving excellent surface completion and thickness control • Suitable for slicing brittle & hard materials, the versatile working-platform design can be applied to a wide range of workpiece cutting • The low kerf-loss reduces lapping & polishing time for the next stage and the waste of manpower and consumable • The user-friendly computer-interfaced system is easy to operate and maintain, long consumable life, simple consumable replacement, and easy to acquire spare parts